Adrian Lis Email
Director - Head of FE Platform Chip Package Interaction @ STMicroelectronics
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Adrian Lis Location
- Germany
Adrian Lis Work
- Director - Head of FE Platform Chip Package Interaction @ (February 2026 - Present)
- Lead Principal @ (April 2024 - February 2026)
- Principal Engineer @ (June 2021 - March 2024)
- R and D Concept Engineer @ (April 2019 - June 2021)
- R and D Process Engineer @ (August 2018 - March 2019)
- Assistant Professor @ (April 2017 - June 2018)
- Postdoctoral Researcher @ (April 2016 - March 2017)
- Postdoctoral Researcher @ (November 2015 - February 2016)
- PHD Student @ (January 2012 - October 2015)
- Project Engineer @ (October 2011 - December 2011)
- Master Thesis Student @ (April 2011 - September 2011)
- Intern @ (April 2010 - July 2010)
- Exchange Student @ (August 2009 - December 2009)
- Working Student @ (February 2008 - July 2008)
- Intern @ (April 2006 - July 2006)
- Vacation Student @ (July 2005 - August 2005)
Adrian Lis Education
- ETH Zürich
Doctor of Philosophy (Ph.D.) (Mechanical Engineering / Materials Science)
2012-2015 - RPTU Kaiserslautern-Landau
Master’s Degree (Mechanical Engineering)
2006-2011
Adrian Lis Summary
- Adrian Lis, based in Germany, is currently a Director - Head of FE Platform Chip Package Interaction at STMicroelectronics. Adrian Lis brings experience from previous roles at Infineon Technologies. Adrian Lis holds a 2012 - 2015 Doctor of Philosophy (Ph.D.) in Mechanical Engineering / Materials Science @ ETH Zürich. Adrian Lis has 2 emails on RocketReach.
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