Manager Engineering Packaging @ (June 2021 - July 2022)
Sr. Packaging Engineer @ (February 2021 - June 2021)
Corporate Packaging Engineer @ (July 2019 - February 2021)
Senior Packaging Engineer @ (August 2015 - July 2019)
Packaging Engineer @ (April 2014 - August 2015)
Package Engineer @ (March 2011 - April 2014)
Associate Packaging Engineer @ (January 2010 - March 2011)
Aaron Cole Education
Roosevelt University
Master of Business Administration - MBA (Marketing)
2018-2021
UW-Stout Polytechnic
BS (Packaging Engineering)
2004-2009
Aaron Cole Skills
Packaging
SAP
Lean Manufacturing
AutoCAD
Account Management
Catia
Food Packaging
Spreadsheets
Business Analysis
Vendor Management
Solutions
Materials
Medical Devices
Consumer Goods
Budgeting
Testing
Manufacturing
Dynamics
Corrugated
Solutions Architect
Product Development
Project Management
Financial Statements
Computer Aided Design Cad
Alcatel
Packaging Engineering
Continuous Improvement
Consumer Products
Packaging Design
Value Engineering
Computer Aided Design
Aaron Cole Summary
Aaron Cole, based in Chicago, IL, US, is currently a Senior Packaging Engineer at ofi North America (Olam Food Ingredients). Aaron Cole brings experience from previous roles at Cresco Labs. Aaron Cole holds a 2018 - 2021 Master of Business Administration - MBA in Marketing @ Roosevelt University. With a robust skill set that includes Packaging, SAP, Lean Manufacturing, AutoCAD, Account Management and more. Aaron Cole has 2 emails and 1 mobile phone numbers on RocketReach.
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