Aaron Cole Email & Phone Number
Senior Packaging Engineer @ ofi North America (Olam Food Ingredients)
5 free lookup(s).
Aaron Cole Location
- Chicago, IL, US
Aaron Cole Work
- 2025 - now Senior Packaging Engineer @
- 2022 - 2025 Sr. Engineering Manager - Packaging @
- 2021 - 2022 Manager Engineering Packaging @
- 2021 - 2021 Sr. Packaging Engineer @
- 2019 - 2021 Corporate Packaging Engineer @
- 2015 - 2019 Senior Packaging Engineer @
- 2014 - 2015 Packaging Engineer @
- 2011 - 2014 Package Engineer @
- 2010 - 2011 Associate Packaging Engineer @
Aaron Cole Education
- Roosevelt University
Master of Business Administration - MBA (Marketing)
2018 - 2021 - University of Wisconsin-Stout
BS (Packaging Engineering)
2004 - 2009
Aaron Cole Skills
- Packaging
- SAP
- Lean Manufacturing
- AutoCAD
- Account Management
- Catia
- Food Packaging
- Spreadsheets
- Business Analysis
- Vendor Management
- Solutions
- Materials
- Medical Devices
- Consumer Goods
- Budgeting
- Testing
- Manufacturing
- Dynamics
- Corrugated
- Solutions Architect
- Product Development
- Project Management
- Financial Statements
- Computer Aided Design Cad
- Alcatel
- Packaging Engineering
- Continuous Improvement
- Consumer Products
- Packaging Design
- Value Engineering
- Computer Aided Design
Aaron Cole Summary
- Aaron Cole, based in Chicago, IL, US, is currently a Senior Packaging Engineer at ofi North America (Olam Food Ingredients). Aaron Cole brings experience from previous roles at Cresco Labs. Aaron Cole holds a 2018 - 2021 Master of Business Administration - MBA in Marketing @ Roosevelt University. With a robust skill set that includes Packaging, SAP, Lean Manufacturing, AutoCAD, Account Management and more. Aaron Cole has 2 emails and 1 mobile phone numbers on RocketReach.
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