4D Chips Information

The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to go vertical. We have invented a revolutionary semiconductor die stacking technology that dramatically reduces system power consumption, effectively eliminates inter-chip delay / capacitance and exponentially increases the system functionality within existing area and cost constraints. Our patent protected innovation enables deep sub-micron precision in inter-die alignment. This allows system designers to effectively meet end-user requirements for power consumption, functionality, form factor and cost. 4D Chips has assembled an ecosystem of expert partners, backed by patented manufacturing innovation, that will enable virtually unlimited vertical integration. We provide technology and services that enable system vendors to build world-class products.