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3D stacking od Silicon and PCB's is the future! We are dedicated in implementation, designing and promoting of 3D stacking technolgies as the next frontier of inegration and reduction of footprint, weight, and power of complex electronic products. As silicon feature sizes take longer and with larger efforts to further is size, larger gains in integration can be realized in using 3D stacking to solve adding more features and processing power in a given footprint. Our team here at Town Line Technologies strongly support the 3D SiPCB concept We provide design / layout / consulting services for image sensing and video markets in the consumer, machine vision, medical, military, x-ray, and scientific space. Our passions here are CMOS image sensors. 25 years in the image sensor business, with a long history going all the way back to vidicon & plumicon tube cameras for medical x-ray, to CID sensors to fifteen years of designing and supplying CMOS linear and 2D area array sensor products, our team can provide you with your image sensor solution! We look forward to working with companies that are interested in exploring how 3D stacking can be the right solution for their next sensor product! For further information: Please contact us for more general inquries, access to resources, and advertising opportunities!

3D SiPCB Questions

The 3D SiPCB annual revenue was $1 million in 2026.

3D SiPCB is based in Cortland, New York.

The NAICS codes for 3D SiPCB are [334, 33].

The SIC codes for 3D SiPCB are [36, 367].

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