NexPlanar Corporation designs, tests, and manufactures highly specialized CMP pads using proprietary “nano-domain” technology for the production of advanced semiconductors and hard drives. Utilizing a very repeatable compression molded manufacturing process, our unique solo pad technology provides improved planarity and across the wafer uniformity and can be utilized to customize the pads for specific applications. The application specific CMP pads can be tuned, for example, for sensitive structures on the device by varying the hard and soft domains of the pad. NexPlanar’s “nano-lubricants” and patented molded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, and allow the use of low slurry consumption processing.
| Website | https://www.nexplanar.com |
| Employees | 10 (2 on RocketReach) |
| Founded | 2008 |
| Industry | Semiconductors |
| Web Rank | 2 Million |
| Keywords | Semiconductor Manufacturing, Chip Manufacturing, Nano Technology, Semiconductor Equipment, Wafer Polishing, Chemical Mechanical Planarization, Nanomaterials, Data Storage Technology, Precision Manufacturing, Advanced Materials, High Precision Components, Compression Molding, Materials Science, Process Technology, Manufacturing Technology |
| Competitors | Applied Materials, ASML, KLA, Lam Research, Teradyne, Lattice Semiconductor, Tokyo Electron, Veeco, Pico Group, Akrion +43 more (view full list) |
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David Davies is the CFO of Nexplanar Corporation.
2 people are employed at Nexplanar Corporation.
Nexplanar Corporation is based in Hillsboro, Oregon.
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David Davies
Chief Financial Officer at Nexplanar Corporation
Hillsboro, OR, US25
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