Cuptronic Technology Information

An ADHESION-PROMOTION company that has developed a unique technology for attaching metals to non-metal materials. For detailed information, please access our presentations via our website link below. We specialize in product solutions for METALIZATION of non-metal surfaces, for example Plating on Plastic (POP) and Printed Circuit Boards (PCB). PREMIUM ADHESION AT REDUCED COST - More resilient product - Higher yield A WIDE VARIETY OF MATERIALS can be used - Materials optimized to your application - More applications – including transparent plastics and Teflon - Few restrictions on the shape or size of components - Cheaper materials can be chosen IMPROVED SURFACE PROPERTIES Can metalize smoother, thinner, more precise surfaces. The Cuptronic Process does not use etching, but instead chemically creates customized polymers that extend up from the surface. On these structures, metals are deposited using conventional plating methods such as electroless chemistry. SIMPLE PRODUCTION - The Cuptronic Process can be easily implemented for industrial production. - It is not limited by temperature and is performed in normal room conditions. IMPROVED HIGH-FREQUENCY PROPERTIES Improved high-frequency properties, because we can plate on very smooth substrates with very thin copper (1-5 μm). ENVIRONMENTALLY FRIENDLY Increased yield, and reduced use of hexavalent chromium HOW WE WORK Components can be produced on-site at our production facility in Stockholm. Alternatively, we can license our process production and know-how, and help you install a simple addition to your existing production line. It is important for us to add our knowledge to our clients' product development at an early stage. Working hand-in-hand with our clients in this way results in a better product and avoids future problems.