Daniel Hou Email

Technical Lead @ Tongdun Technology

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Daniel Hou Location

Dalian, CN

Daniel Hou Work

2018 - now Technical Lead @ Tongdun Technology
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2017 - 2018 Senior Software Development Engineer @ IBM
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2017 - 2017 AM @ Accenture
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2015 - 2017 Java and Hybris Engineer @ SAP
2012 - 2015 Senior Software Engineer @ Fidelity Investments
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2009 - 2012 Software Engineer @ Neusoft
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Daniel Hou Education

Da Lian Maritime University
Master of Computer Applications (M.C.A.) (Software Engineer)
2007 - 2009
Liao Ning Normal University
Bachelor of Computer Application (Software Engineer)
2003 - 2007

Daniel Hou Skills

Java
软件开发
SQL

企业级软件
Web 服务
JavaScript
Akka
Hybris

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Daniel Hou Summary

Daniel Hou, based in Dalian, CN, is currently a Technical Lead at 同盾科技. Daniel Hou brings experience from previous roles at IBM, 埃森哲, SAP and 富达. Daniel Hou holds a 2007 - 2009 Master of Computer Applications (M.C.A.) in Software Engineer @ Da Lian Maritime University. With a robust skill set that includes Java, 软件开发, SQL, 企业级软件, Web 服务 and more. Daniel Hou has 1 emails on RocketReach.

Daniel Hou Emails

Found 1 emails

@tongdun.cn

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